USC Dry Non-Contact Cleaning System
Based on Ultrasonic (USC) dry-type cleaning technology, high-frequency pneumatic oscillation disrupts the adhesive boundary layer, achieving sub-micron cleaning precision.
● Suitable for semiconductors, glass substrates, and photovoltaic wafers
● Dry process — no water or chemical solvents required, environmentally friendly
- Parameters
Based on Ultrasonic (USC) dry-type cleaning technology, high-frequency pneumatic oscillation disrupts the adhesive boundary layer, achieving sub-micron cleaning precision.
● Suitable for semiconductors, glass substrates, and photovoltaic wafers
● Dry process — no water or chemical solvents required, environmentally friendly
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Contact Person: Mr. Li
Tel: +86 18620114047
E-mail: liyancan001@gmail.com
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Contact
Contact Person: Mr. Li
Tel: 18620114047
E-mail: liyancan001@gmail.com
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